Polyjet

ENVISIONTEC ULTRA 3SP HD (High Definition)

System Properties
»»Single material for both build and support
»»Easily removable, partially cured perforated supports
»»Very few moving parts
»»Office friendly plug-and-play operation with a built-in touch screen
»» 3SP® (Scan, Spin, and Selectively Photocure) technology
»»Low part cost due to minimal material waste
»»Produce everything from concept models to functional parts
»»Layerless technology with no stair stepping on inner and outer surfaces
»»Quiet operation

Reference : M151106
rea-securite
Validated & certified by Multistation
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High Definition model:

Build Enveloppe: 266 x 175 x 193 mm (10.5″ x 6.9″ x 7.6″)
Resolution ion the 3 axis:  50 μm (0.002″)

Delivered with 3SP Tough resin

YOM: 2015 – Few hours

Type/Model : ENVISIONTEC

YOM : 2015

Process : DLP (Diode Light Processing)

Condition : Très bon état

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